Thermal processing induced plastic deformation in GaAs wafers
نویسندگان
چکیده
منابع مشابه
Thermal processing induced plastic deformation in GaAs wafers
Different types of dislocation bundles were identified in the (001) GaAs substrates of III–V heterostructures. Comparisons of scanning infrared polariscopy images and X-ray transmission topograms showed a one to one correlation of stripes of reduced residual shear strain and dislocation bundles of the majority type. Visible-light interferometry and Makyoh topography, on the other hand, showed a...
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ژورنال
عنوان ژورنال: Materials Science and Engineering: B
سال: 2001
ISSN: 0921-5107
DOI: 10.1016/s0921-5107(00)00620-6